ANSYS Icechip brings powerful and easy-to-use thermal analysis to Cadence APD and Sigrity UPD (previously Synopsys Encore). Make thermal analysis a seamless part of the design process.

• Simulate all common packaging types -- leaded, leadless, BGA, Multi-chip packages, stacked die, system-in-package and multi-chip packages including traces, vias and wire bonds
• Easy and intuitive user interface brings thermal analysis to designers without the need for a specialized background in heat transfer.
• Perform trade studies to optimize the thermal design
• The direct ECAD interface imports every die (even stacked die), trace, via, solderballs, encapsulant and bond wires.
• Import complex geometry like lead frames or heat spreaders from MCAD tools.
• Define non uniform power at the die level to predict hot spots.
• Export the model to ANSYS for stress analysis
• Put the component on a standard JEDEC board and simulate JEDEC thermal tests.
• Fast solve time, typically minute

• ANSYS Icechip Product Brochure (368 KB)

• Simulate any package style -Single, multi-die packages and/or stacked die, Ball Grid Array, System-In-Package, leaded or leadless packages
• Launch ANSYS Icechip from within Cadence APD or Sigrity UPD.

Imports all the data

Every trace, via, bond wire, solderball, substrate layer and die is imported The simulation accounts for the heat transfer through every trace and via automatically. No guessing at the properties like with other tools.

ANSYS Icechip can handle complex geometry

Import complex geometry like lead frames and heat spreaders from DXG or DWG files

Optimize the package thermal design by easily changing materials, geometry or boundary conditions.  View a complete summary of the results.

Accurately predict temperature gradients over the die surface by defining exactly where the power is dissipated.  Import the power dissipation from a file as well.